The Nanoverse NVT Series

where precision meets flexibility

EXPLORE THE NVT SERIES AND SEE WHAT PRECISION REALLY LOOKS LIKE

At Nanoverse, we’re transforming semiconductor manufacturing with a powerful blend of advanced metrology, ultrafast laser processing, and intelligent automation. Our systems deliver rapid, high-resolution 3D data acquisition, exceptional repeatability, and industry-leading defect detection—making it easier than ever to make fast, accurate decisions in both inspection and production environments. With <1μm scribe accuracy and minimal thermal impact, our tools ensure clean cuts, higher die yields, and stronger device integrity. And with AI and machine learning built in, Nanoverse empowers smarter automation and scalable data analysis across the entire process.

NVT-7700

- Higher accuracy through patented beam positioning and power control
- Higher laser power than rest of market
- Faster motion, supporting higher wafer through-put
- 100% wafer inspection, not just feature inspection
- Real-time defect detection
- Real-time observation of coating process
- Continuous delivery of material forzero downtime
- Flexible layout for unique facilities
- Place Peripheral Cabinet anywhere
- Add or remove modules as needed
- Multiple user and technician terminal locations
- Modular design for in-field updates supporting new processes
- Optimized baking process for plasma dicing
- Flow that allows for multiple processes on single wafer
- Single system for unmounted and tape frame wafers

NVT-5500

- General measurement
- Scribe detection
- Bump measurement
- Bare wafer particle detection
- Edge inspection
- Surface Uniformity, Shape, Flatness
- 100% wafer inspection, not just feature inspection
- Real-time defect detection
- Wafer data storage for offline analysis
- CAD equivalent interactions with analysis and reporting visualizations
- Single system for unmounted and tape frame wafers
- Modular design for in-field updates supporting new processes

NVT-6600

- Higher accuracy through patented beam positioning and power control
- Higher laser power than rest of market
- Faster motion, supporting higher wafer through-put
- Real-time observation of coating process
- Continuous delivery of material forzero downtime
- Support for multiple types of material
- Flexible layout for unique facilities
- Place Peripheral Cabinet anywhere
- Multiple laser types supported via configurable optics/beam path
- Single system for unmounted and tape frame wafers
- Modular design for in-field updates supporting new processes

NVT-9900

- Higher accuracy through patented beam positioning and power control
- Higher laser power than rest of market
- Faster motion, supporting higher wafer through-put
- Real-time observation of coating process
- Continuous delivery of material for zero downtime
- Support for multiple types of material
- Flexible layout for unique facilities
- Place Peripheral Cabinet anywhere
- Add or remove modules as needed
- Optimized baking process for plasma dicing
- Flow that allows for multiple processes on single wafer
- Modular design for in-field updates supporting new processes
- Single system for unmounted and tape frame wafers
- Support for unique or same laser modules, creating flexibility or through-put